On the Development of CMOS Sub-THz Phased Array Technology for Communication/Sensing Nodes
Summary form of only given: In this paper, we present a single chip cross-layer approach for a new class of highly integrated CMOS millimeter wave and sub-THz communication and sensing wireless systems. It is based on the convergence of fully integrated CMOS digital radio and beam former, low power multi-gigabit mixed-signal processing and low cost packaging with embedded antenna. A 60 GHz CMOS/PCB portable beam-former solution and highly scalable V-band CMOS 45 nm architecture are highlighted as leading edge examples of such an approach, enabling breakthrough power/size reduction and multi-gigahertz bandwidth and processing speeds. These single chip millimeter wave and sub-THz system-on-chip solutions are the fundamental enablers for a wide range of communication and sensing applications operating from V-band to W-band and beyond.
2010 IEEE MTT-S International Microwave Symposium
Laskar, J.; Pinel, S.; Sarkar, S.; Sen, P.; Perunama, B.; Dawn, Debasis; Leung, M.; Barale, F.; Yeh, D.; Shin, S.; Hsiao, S. W.; Chuang, K.; Juntunen, E.; Iyer, G.; Muppalla, A.; and Melet, P., "On the Development of CMOS Sub-THz Phased Array Technology for Communication/Sensing Nodes" (2010). Institute of Technology Publications. 242.